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Power chips are linked to outside circuits through product packaging, and their performance depends upon the assistance of the packaging. In high-power scenarios, power chips are usually packaged as power modules. Chip affiliation refers to the electric link on the upper surface area of the chip, which is generally aluminum bonding cable in standard modules. ^
Conventional power module plan cross-section

Currently, commercial silicon carbide power components still mostly utilize the product packaging modern technology of this wire-bonded conventional silicon IGBT module. They deal with problems such as huge high-frequency parasitic specifications, inadequate warmth dissipation capacity, low-temperature resistance, and inadequate insulation stamina, which limit using silicon carbide semiconductors. The display of superb efficiency. In order to fix these issues and fully make use of the substantial prospective benefits of silicon carbide chips, many new packaging innovations and solutions for silicon carbide power modules have actually arised recently.

Silicon carbide power component bonding approach


(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have actually established from gold cable bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually established from gold cords to copper wires, and the driving pressure is expense decrease; high-power devices have actually established from aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance product performance. The better the power, the higher the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that utilizes a solid copper bridge soldered to solder to link chips and pins. Compared to typical bonding product packaging techniques, Cu Clip innovation has the complying with benefits:

1. The link in between the chip and the pins is made from copper sheets, which, to a particular degree, replaces the basic cable bonding approach between the chip and the pins. For that reason, an unique package resistance worth, greater current circulation, and much better thermal conductivity can be obtained.

2. The lead pin welding area does not require to be silver-plated, which can fully conserve the expense of silver plating and bad silver plating.

3. The product look is totally constant with normal products and is mainly used in servers, portable computer systems, batteries/drives, graphics cards, motors, power products, and other fields.

Cu Clip has 2 bonding methods.

All copper sheet bonding method

Both the Gate pad and the Resource pad are clip-based. This bonding approach is much more costly and complicated, however it can accomplish better Rdson and much better thermal results.


( copper strip)

Copper sheet plus wire bonding technique

The source pad utilizes a Clip approach, and eviction makes use of a Wire technique. This bonding approach is somewhat less expensive than the all-copper bonding approach, conserving wafer location (relevant to really tiny entrance areas). The procedure is less complex than the all-copper bonding approach and can get far better Rdson and better thermal effect.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding bare bright copper, please feel free to contact us and send an inquiry.

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